Products
We provide wide range of soldering material solutions to you.
Semiconductor Package
- DS-0303 (BGA FLUX)
- DS-350 (Plating Bumping)
- DS-0303B (Ball drop Bumping)
- DS-0304 WS1 (Laser Soldering)
- DS-0303F (Flipchip)
Semiconductor Module
- DS-0201 LF 305 O (Non-Cleaning Type)
- DS-0304 LF 305 (Water Soluble Type)
- DS-0304 LF 305 Laser (Water Soluble Type)
Electronics
- DS-0201 LF 305
- DS-0201 LF 305 C #6 (Cellphone)
- DS-0201 LF 5 (High Temperature Soldering at 238~242ºC)
- DS-0201 LF 58 (Low Temperature Soldering 138ºC )
Micro LED
- DS-0201 LF 305 ML #6,7 (Solder paste)
- DS-550 Flux for Micro LED
Automotive
- DS-0201 LF 305
- DS-0201 FP 290 (High Temperature Soldering 290 ºC)
- DS-0201 FP 330 (Ulta Temperature Soldering 330ºC)
- DS-0201 LF 305 A (Non-Cleaning Type)
- DS-0201 LF 305 Laser
Flux and Cleaner
Liquid Flux
- SF-2030/2050
(Low residue Rosin Base) - SF531/630(Water soluble)
Defoamer
- DF-1215
(for PCB Manufacturing process)
Cleaner
- SC701
(VOC Free stencil Cleaner) - Alkaine
(Water soluble Flux cleaner)
- SC701
Wire and Solder
Solder Wire
- DS-WF-x.x
(Flux cored Pb Solder) - DSPF-WF-x.x
(Flux cored Pb free Solder)
Anode Solder Ball
- DSC- xxx
( Cylindrical type) - DSP- xxx
(Plate type)
EMI Shield
- EMI Shield Rate: 50~60 dB
- Substrate: SIP Module, PE, PI, PTE, Glass, Ceramics
- Shapes: 2D and 3D
- Applications: Semiconductors
Automotive
Semiconductor Package Applications
| Model | Flux type | Features |
|---|---|---|
| DS-0303 (BGA FLUX) | Water Soluble | Flux for BGA |
| DS-350 (Metal Bumping) | Water Soluble | Flux for metal Bump |
| DS-0303B (Ball drop Bumping) | Water Soluble | Flux for Ball drop |
| DS-0304 WS1 (Laser Soldering) | Water Soluble | Flux for Laser Soldering |
| DS-0303F (Flipchip) | Water Soluble | Flux for Flipchip |
Semiconductor Module Applications
| Model | Flux type | Alloy | Powder Size | Melting Point | Features |
|---|---|---|---|---|---|
| DS-0201 FP 330 | Non-Cleaning | Sn/95Pb/2.5Ag | #3,4,5 | 330 ºC | Automotive |
| DS-0201 LF 58 | Non-Cleaning | Sn/58Bi | #3,4,5 | 138 ºC | Automotive Cooler, Heatsink |
| DS-0201 LF 5 | Non-Cleaning | Sn/5Sb | #3,4,5 | 238~242 ºC | 4G and 5G Station |
| DS-0304 LF 305 | Water Soluble | Sn/3.0Ag/0.5Cu | #4,5,6,7,8 | 218~220 ºC | Flip Chip, SIP,Laser Soldering |
Electronics Applications
| Model | Flux type | Alloy | Powder size | Melting point | Features |
|---|---|---|---|---|---|
| DS-0201 LF 305 | Non-Cleaning | Sn/3.0Ag/0.5Cu | #4,5,6,7,8 | 218~220 ºC | Memory, Mobile phone, Automotive, Micro LED |
| DS-0201 LF 305 C # | Non-Cleaning | Sn/3.0Ag/0.5Cu | #4,5,6,7,8 | 218~220 ºC | Memory, Mobile phone, Automotive, Micro LED |
| DS-0201 LF 305 ML #6, 7 | Non-Cleaning | Sn/3.0Ag/0.5Cu | #4,5,6,7,8 | 218~220 ºC | Memory, Mobile phone, Automotive, Micro LED |
| DS-0201 LF 5 | Non-Cleaning | Sn/5Sb | #3,4,5 | 238~242ºC | 4G Station 5G Station |
| DS-0201 LF 58 | Non-Cleaning | Sn/58Bi | #3,4,5 | 138ºC | Cooler for Automotive, Heatsink |
Automotive Applications
| Model | Flux type | Alloy | Powder size | Melting point | Features |
|---|---|---|---|---|---|
| DS-0201 FP 290 | Non-Cleaning | Sn/95Pb | #3,4,5 | 290ºC | Automotive |
| DS-0201 FP 330 | Non-Cleaning | Sn/95Pb/2.5Ag | #3,4,5 | 290ºC | Automotive |
| DS-0201 LF 305 A | Non-Cleaning | Sn/3.0Ag/0.5Cu | #4,5,6,7,8 | 218~220ºC | Automotive |
Semiconductor Package Applications
Pb Free Alloy: Sn96.5%, Ag3%, Cu 0.5%
| Type Designation | Particle Size | Rosin Base | Water Base |
|---|---|---|---|
| 4 | 20~38um | Available | Available |
| 5 | 15~25um | Available | Available |
| 6 | 5~15um | Available | Available |
| 7 | 2~12um | Available | Available |